Electronics | Rigid Conductive Foam (HSP-CF-H)
HSP’s semi rigid conductive foam is designed to protect sensitive integrated components from static discharge by ensuring a uniform potential between all the pins.
The semi rigid nature is specifically designed to allow easy insertion with out damaging pins, whilst holding the component firmly.
HSP-CF-H is non corrosive, non shedding and non marking and has surface resistivity of 103 to 105 Ohms/square.
The material is available in 6mm and 10mm as standard (other thicknesses available on request), and can be supplied in full sheets or cut parts.
Rigid Conductive Foam (HSP-CF-H) Product Data
| Property | Typical Value |
|---|---|
| FOAM TYPE | Polyether based Polyurethane impregnated With a carbon loaded rigid latex |
| DENSITY | >35Kg/m3 |
| SURFACE RESISTANCE | 104 Ohms |
| VOLUME RESISTANCE | 30 Ohm m |
| COMPRESSION SET | 25% |
| COLOUR | Black |
| FORMAT | Sheets / Cut parts |
Grade
HSP-CFH
Additional Notes
A semi rigid electronically conductive foam
Uses
Physical and static protection of integrated circuits via pin insertion
Download Product Sheet
Our materials are designed to offer protective packaging to static sensitive devices
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